Conference
ACTIVE
29th June, 2026
EIECT 2026 : IEEE 2026 6th International Conference on Electronic Information Engineering and Computer Technology
In cooperation with
IEEE
Pending Verification
Affiliation claimed by the organiser — confirmation in progress.
Submission Deadline:
15th July, 2026
— 15 days remaining
About the Conference
IEEE 2026 6th International Conference on Electronic Information Engineering and Computer Technology (EIECT 2026) will be held in Beijing, China, from September 4-6, 2026.
𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/Mjuiii
---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
Track 1: Electronic Information Engineering
◕ Communication and Wireless Technologies
6G Frontier Communications
Future Cellular Networks
Terahertz Communications
Satellite-Integrated Communications
Internet of Vehicles (IoV) Communications
......
◕ Network Architectures and Protocol Technologies
Next-Generation Internet
Software-Defined Networking (SDN)
Network Function Virtualization (NFV)
Data Center Networks
Cloud-Edge-End Collaboration
Industrial Internet of Things (IIoT) Networks
Smart City Networks
......
◕ Signal Processing and Intelligent Sensing
Intelligent Signal Processing
Multi-Modal Fusion Sensing
Radar Signal Recognition
Communication Signal Detection
Intelligent Image Coding
......
Track 2: Computer Technology
◕ Artificial Intelligence and Large Models
Artificial Intelligence for Communications (AI4Comm)
AI Theory
Reinforcement Learning
Federated Learning
Trustworthy and Secure AI
......
◕ Computer Technologies
Intelligent Computing Architecture
High-Performance Computing (HPC)
Heterogeneous Computing Architecture
Distributed Systems
Cloud-Native Technology
......
◕ Data Intelligence and Application Systems
Data Mining
Knowledge Graph
Intelligent Recommendation Systems
Privacy-Preserving Computation
Intelligent Internet of Things (IIoT)
......
Track 3: Electronics and Integrated Circuits
◕ Integrated Circuit Design and Manufacturing
Integrated Circuit Design
Low-Power IC
Advanced Process Technology
System-on-Chip (SoC)
3D Packaging Technology
◕ Semiconductor Devices and Materials
Semiconductor Materials
Power Electronic Devices
Optoelectronics and Integrated Photonics
Nanoelectronic Devices
Quantum Devices
◕ Embedded and Electronic Systems
Reconfigurable Computing
Embedded Systems
Sensors
Intelligent Hardware Systems
Electronic Testing and Measurement
---𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗦𝗽𝗲𝗰𝗶𝗮𝗹 𝗦𝗲𝘀𝘀𝗶𝗼𝗻---
Special Session 1: Emerging Wireless Technologies for AI-native 6G
Special Session 2: Wireless Intelligent System Twins Alliance for 6G and Beyond
Special Session 3: Cutting-Edge Technologies for Next-Generation Satellite-Air-Ground Integrated Networks
Special Session 4: Agentic AI-Native Communications and Networking: Architecture, Protocols, and Applications
Special Session 5: Al-driven Models for Wireless Communication Technologies
Special Session 6: Wireless Propagation for Emerging Applications of Integrated Sensing and Communication
Special Session 7: AI-Driven Wireless Propagation and Channel Modeling
Special Session 8: Next-Generation Intelligent Communications and Network Optimization
Special Session 9: Green and Energy-Efficient AI-Native Wireless Systems
Special Session 10: Intelligent Optical Networking Technologies for AI-Driven Data Centers
---𝗞𝗲𝘆𝗻𝗼𝘁𝗲 𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Weihua Zhuang,Fellow of the Canadian Academy of Engineering, IEEE Fellow,University of Waterloo, Canada
Prof. Markus Rupp,IEEE Fellow,Technische Universität Wien, Austria
Prof. Yan Zhang,IEEE Fellow,University of Electronic Science and Technology of China, China
Prof. Shiwen Mao,IEEE Fellow,Auburn University, USA
Prof. Tian Hong Loh,IEEE Fellow,National Physical Laboratory, U.K.
---𝗜𝗻𝘃𝗶𝘁𝗲𝗱 𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Nikos C. Sagias,University of Peloponnese, Greece
Dr. Philipp Svoboda,Technische Universität Wien, Austria
Assoc. Prof. Xingqi Zhang,University of Alberta, Canada
Prof. Yang Wang,Chongqing University of Posts and Telecommunications, China
Prof. Vladimir Poulkov,Technical University of Sofia, Bulgaria
---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in IEEE (ISBN: 979-8-3195-3853-6), and submitted to EI Compendex, Scopus and Inspec for indexing.
---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission Date: July 15, 2026
Camera Ready Papers: August 01, 2026
Registration Deadline: August 01, 2026
Conference Dates: September 4-6, 2026
--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/Mjuiii
𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/Mjuiii
---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
Track 1: Electronic Information Engineering
◕ Communication and Wireless Technologies
6G Frontier Communications
Future Cellular Networks
Terahertz Communications
Satellite-Integrated Communications
Internet of Vehicles (IoV) Communications
......
◕ Network Architectures and Protocol Technologies
Next-Generation Internet
Software-Defined Networking (SDN)
Network Function Virtualization (NFV)
Data Center Networks
Cloud-Edge-End Collaboration
Industrial Internet of Things (IIoT) Networks
Smart City Networks
......
◕ Signal Processing and Intelligent Sensing
Intelligent Signal Processing
Multi-Modal Fusion Sensing
Radar Signal Recognition
Communication Signal Detection
Intelligent Image Coding
......
Track 2: Computer Technology
◕ Artificial Intelligence and Large Models
Artificial Intelligence for Communications (AI4Comm)
AI Theory
Reinforcement Learning
Federated Learning
Trustworthy and Secure AI
......
◕ Computer Technologies
Intelligent Computing Architecture
High-Performance Computing (HPC)
Heterogeneous Computing Architecture
Distributed Systems
Cloud-Native Technology
......
◕ Data Intelligence and Application Systems
Data Mining
Knowledge Graph
Intelligent Recommendation Systems
Privacy-Preserving Computation
Intelligent Internet of Things (IIoT)
......
Track 3: Electronics and Integrated Circuits
◕ Integrated Circuit Design and Manufacturing
Integrated Circuit Design
Low-Power IC
Advanced Process Technology
System-on-Chip (SoC)
3D Packaging Technology
◕ Semiconductor Devices and Materials
Semiconductor Materials
Power Electronic Devices
Optoelectronics and Integrated Photonics
Nanoelectronic Devices
Quantum Devices
◕ Embedded and Electronic Systems
Reconfigurable Computing
Embedded Systems
Sensors
Intelligent Hardware Systems
Electronic Testing and Measurement
---𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗦𝗽𝗲𝗰𝗶𝗮𝗹 𝗦𝗲𝘀𝘀𝗶𝗼𝗻---
Special Session 1: Emerging Wireless Technologies for AI-native 6G
Special Session 2: Wireless Intelligent System Twins Alliance for 6G and Beyond
Special Session 3: Cutting-Edge Technologies for Next-Generation Satellite-Air-Ground Integrated Networks
Special Session 4: Agentic AI-Native Communications and Networking: Architecture, Protocols, and Applications
Special Session 5: Al-driven Models for Wireless Communication Technologies
Special Session 6: Wireless Propagation for Emerging Applications of Integrated Sensing and Communication
Special Session 7: AI-Driven Wireless Propagation and Channel Modeling
Special Session 8: Next-Generation Intelligent Communications and Network Optimization
Special Session 9: Green and Energy-Efficient AI-Native Wireless Systems
Special Session 10: Intelligent Optical Networking Technologies for AI-Driven Data Centers
---𝗞𝗲𝘆𝗻𝗼𝘁𝗲 𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Weihua Zhuang,Fellow of the Canadian Academy of Engineering, IEEE Fellow,University of Waterloo, Canada
Prof. Markus Rupp,IEEE Fellow,Technische Universität Wien, Austria
Prof. Yan Zhang,IEEE Fellow,University of Electronic Science and Technology of China, China
Prof. Shiwen Mao,IEEE Fellow,Auburn University, USA
Prof. Tian Hong Loh,IEEE Fellow,National Physical Laboratory, U.K.
---𝗜𝗻𝘃𝗶𝘁𝗲𝗱 𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Nikos C. Sagias,University of Peloponnese, Greece
Dr. Philipp Svoboda,Technische Universität Wien, Austria
Assoc. Prof. Xingqi Zhang,University of Alberta, Canada
Prof. Yang Wang,Chongqing University of Posts and Telecommunications, China
Prof. Vladimir Poulkov,Technical University of Sofia, Bulgaria
---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in IEEE (ISBN: 979-8-3195-3853-6), and submitted to EI Compendex, Scopus and Inspec for indexing.
---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission Date: July 15, 2026
Camera Ready Papers: August 01, 2026
Registration Deadline: August 01, 2026
Conference Dates: September 4-6, 2026
--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/Mjuiii
Topics of Interest
4 topicsResearch papers are invited in, but not limited to, the following areas:
Venue Information
Beijing, China
Special conference rates often available near the venue.
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